2018-2019 MIAE Graduate Seminar Series
Time & Location
About The Event
MIAE 2018-2019 Graduate Seminar Series
“The Art of Defining Printing Process for Rapid Fabrication of 3D Electronics at Mesoscale and Its Potential for Industrialization ”
By Prof. Yu Liu, Jiangnan University, China
3D electronics with mesoscale size ranging from tens of microns to millimeters are being widely considered in the fields of consumable electronics, biomedicals, automotive, and soft robots. Printing process, which can be traced back to its history more than one thousand year ago, has been extensively and lately redefined, and its digital definition has led a quick expansion of additive manufacturing or 3D printing across many sectors. In this speech, we are going to share our latest results on exploring how to define an effective automated printing platform for direct fabrication of 3D electronics. Emphasizes will be on process control for precise dimensioning of filament accuracy, function deposition, and its latent resolution for micro/nano fabrication. Especially, direct ink writing and its evolutions will be discussed through some case studies. In addition, we are going to deliver some industrial considerations which are in keen need of rapid prototyping of functional devices. Final remarks will be given on how far to integrate intelligence from different printing engineering for more complex implementation.
Dr. Yu Liu is a professor in school of mechanical engineering at Jiangnan University, Wuxi, China. He is also Professional Engineer of Ontario, IEEE Senior Member, CSMNT / CMES Senior Member. He obtained his B.E., M.Sc. / PhD. in control science, and mechanical engineering, respectively. Dr. Liu has achieved more than 60 peer – reviewed publications and an inventor for more than 70 patents. His both academic and industrial researches in different sectors from transport, energy, building, and environment, are leading his Institute of Precision Intelligent System Engineering (iPISE) for establishing optimal solutions to the emerging 3D mechatronics. iPISE, established at the January of 2017, has quickly developed, through having interacted with doses of local partners and built its increasing local impact on 3D printed electronics and direct fabrication, esp. on equipment and instrumentation & control. The members from mechanical, software, electrical and materials are developing higher performance 3D devices.